Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
Top 15 articles for 2009
Here’s a list of the top 15 articles since our launch in August 2009. Hot topics include memory devices, motor control, power supplies,FPGAs, EMI filters and application-specific capacitors.
Got story ideas for 2010? Send them to me at: editor@electronicsadvocate.com.
Top 15 articles
1. Global DRAM market climbs 34% in Q2
2. Weathering the recession storm, Part 2
3. How to create linear motion step-by-step
4. Earthquake disrupts LCD glass supply, no major impact on panel production, says iSuppli
5. iSuppli teardown: iPhone 3G S BOM and manufacturing cost is $178.96
6. Infineon tops power semiconductor ranking
7. Microchip launches dev boards for motor control designs
8. Avnet releases Xilinx Spartan-6 FPGA evaluation and development kits
9. Gartner’s top 10 technologies and trends for 2010
11. Pricing continues to rise for DDR2, DDR3 and NAND memory devices
12. Silicon-based EMI filters reduce cost, improve receiver sensitivity in wireless handsets
13. Avnet recognized for improving data-center efficiency
14. Application-specific capacitors: A custom fit for any application
15. Aspen Avionics selects SigmaQuest to improve root cause analysis
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. 
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency.