Cisco selects Avnet as specialty distributor for data center products in U.S., Canada
Tempe, Ariz. — Avnet Technology Solutions has signed a distribution agreement with Cisco to become a high-value specialty distributor for its data center products in the U.S. and Canada. Avnet will help Cisco further expand its market penetration into the data center market through qualified value-added resellers (VARs).
Avnet will also create a dedicated business unit to market, sell and service the Cisco data center product suite, which will be led by Avnet executive Chris Swahn, as the vice president and general manager of the new business unit.
Avnet will provide the following Cisco data center products:
- Nexus Data Center Family of Switches
- MDS Family of Fiber Channel SAN Switches
- Catalyst E-Blade Switches
- Unified Computing System (UCS) Blade and Rack Servers (B and C)
- Application Control Engine (ACE)
- WAN Optimization (WAAS)
These products will be offered together with Avnet’s consulting, integration, implementation and managed services to create complete data center solutions.
Avnet said it will also develop market enablement programs based on the success of its technology-focused practices, such as Avnet SecurePath, Avnet StoragePath and Avnet VirtualPath.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
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