Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
TI unveils “Thank an Engineer” video
Texas Instruments has launched its latest “Thank an Engineer” video, World Without Streaming Video, at www.ti.com/thanks.
Here is TI’s message:
Dear engineers,
Thank you. No matter what your engineering specialty: chemical, civil, computer, electrical, industrial, mechanical, etc. (there are so many), you are all unsung heroes. From little things like the alarm clocks that wake us up, to the big things like the roads we drive everyday and the cell phones that keep us connected, they are all in existence today because of you.
What would our lives be like without these inventions? Visit www.ti.com/thanks to view videos showing what we think the world would be like without devices such as remote controls, streaming video and high speed Internet, to name a few.
Appreciatively,
Texas Instruments
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. 
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency.