Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
Samsung ultra-thin multi-chip packaging cuts size in half
Seoul, Korea — Samsung Electronics Co., Ltd. is claiming the industry’s thinnest multi-die package that measures 0.6 mm in height. Designed initially for 32-gigabyte (GB) densities, the new memory package is half the thickness of a conventional memory package of eight stacked chips (or dies). The advanced packaging technology delivers a 40 percent thinner and lighter memory solution for high-density multimedia handsets and other mobile devices.
The new ultra-thin 0.6-mm thick package, which consists of eight identical dies (called an octa-die package), uses 30-nanometer-class, 32 gigabit (Gb) NAND flash chips, each measuring 15 um, to deliver a 32-GB NAND solution.
Samsung says the 15-um thickness represents a significant achievement as it can allow for double the density of previous multi-chip packages. The thinner die also dramatically reduces chip weight.
The “ultra-thinning” technology overcomes the conventional technology limits of a chip’s resistance to external pressure when under 30 um in height, said Samsung. The productivity decline resulting from this thickness limitation has been directly attributed to a drop in production yields during mass production.
In addition, the new package technology can be adapted to other existing MCPs, configured as system in packages (SiPs), or package on packages (PoPs). The breakthrough technique for 15 um-and-under chip thicknesses will allow for the design of very high-density solutions with the smallest of form factors, which is an attractive feature for mobile designs, said Samsung.
iSuppli forecasts 310 million units of memory cards at 2-GB densities and higher will be produced in 2009 (60 percent of total production). The market researcher expects the number to reach 7.7 billion units by 2012 (89 percent of total production).
iSuppli also estimates the portion of memory cards at 16 GB and higher to reach 35 million units (16-GB equivalents) this year, a number expected to reach 530 million units by 2012, representing 15-fold growth. This portion of the overall card production is expected to climb from 33 percent to 74 percent during the same period.
IRC offers a series of open-air current sense resistors, aimed at power electronics design engineers looking for high-current devices capable of providing current-sense and surge protection functions in high-temperature environments.
Maxim intros the MAX17122, a multiple-output power-supply IC that integrates three regulators, delivery a compact solution for TFT-LCD HDTV panels.