Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
No double ordering in the semiconductor industry
El Segundo, Calif. — There is no indication that chip purchasers are double booking orders despite fears that they are inflating semiconductor purchases in order to guarantee adequate supplies, reports iSuppli Corp.
This situation can occur when electronics demand rises while inventories are low, which artificially boosts sales totals that later result in a sales let downturn as orders are cancelled or scaled back, said iSuppli.
However, this doesn’t appear to be the case in late 2009, according to Carlo Ciriello, analyst, financial services, for iSuppli.
In their earnings announcements, leading semiconductor suppliers, including Texas Instruments, STMicroelectronics and Intersil, all reported they saw no signs of double-booking during the third quarter, said Ciriello. “This should give the semiconductor industry confidence that the magnitude of the current recovery accurately reflects real demand levels.”
The lack of double ordering comes amid other encouraging news for the global semiconductor industry. Global chip revenue amounted to $58.3 billion in the third quarter, up 10.6 percent from $52.8 billion in the second quarter, based on iSuppli’s preliminary forecast.
In addition, worldwide semiconductor inventories have been declining; global chip stockpiles fell 2.3 percent in the third quarter compared to the second in terms of revenue, according to iSuppli.
Ciriello says these positive factors point to continued strength in the fourth quarter and a return to annual revenue growth in 2010.
Worldwide semiconductor revenue is set to rise by 3.5 percent sequentially in the fourth quarter. However, on a year-over-year basis, revenue is expected to rise by 10.6 percent in the fourth quarter of 2009. iSuppli says the fourth quarter will mark the first quarter in 2009 that revenue has risen compared to the same period a year earlier.
Global semiconductor revenue is set to rise by 13.8 percent in 2010, following a 16.5 percent contraction in 2009, according to iSuppli’s latest research.
iSuppli’s new report, 10 Segment Q3 and Q4 Inventory Forecast, provides additional information about the electronics market and semiconductor inventories in the third and fourth quarters of 2009.
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. 
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters.