Green handset shipments to reach nearly 500M units by 2014, says researcher
Hampshire, England — Global shipments of green handsets could reach 485 million units by 2014, driven primarily by consumer demand for environmentally-friendly mobile devices, according to Juniper Research.
The report, Green Mobile Handsets & Applications: Strategies, Scenarios & Forecasts 2009-2014, also indicates that even with an incremental attitude shift by consumers, numbers will still grow from 250,000 shipments in 2009 to over 105 million by 2014.
“With manufacturers only now beginning to introduce green handsets, shipment volumes are relatively low in all cases. Moving forward, we should not expect to see production lines of completely green phones, but a gradual move to introducing green elements throughout devices,” said Dr. Windsor Holden, principal analyst at Juniper Research and lead author for the report, in a statement.
The average mobile user is responsible for around 25 kg of CO2 emissions per year for a collective total of 93 Mt (megatons) of CO2 globally at the end of 2008, according to the report. Eco-applications offer potential for the mobile industry to reduce CO2 emissions above and beyond its own direct and indirect emissions by exerting a positive influence on consumer behavior, according to the report.
A key finding shows that network operators and handset vendors should increase their promotion of handset take-back initiatives, and increase take-back targets.
The report offers six-year forecasting for key market parameters including maintaining stable CO2 footprints, electricity costs, no-load CO2 emissions and recycled/refurbished handsets.
The market researcher also offers a Green Handsets white paper.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
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