Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
IBM builds tiny circuit board with DNA scaffolding
IBM researchers are using DNA scaffolding to build tiny circuit boards.
The semiconductor industry is looking at new classes of transistors that use carbon nanotubes or silicon nanowires for developing sub-22-mm lithographic technology. IBM says its approach of using DNA molecules as scaffolding — where millions of carbon nanotubes could be deposited and self-assembled into precise patterns by sticking to the DNA molecules — may provide a way to reach sub-22 nm lithography.
IBM Researchers and collaborator Paul W.K. Rothemund, of the California Institute of Technology, report that their advancement combines lithographic patterning with self-assembly, which is a method to arrange DNA origami structures on surfaces compatible with today’s semiconductor manufacturing equipment.
As a result, the DNA nanostructures can serve as scaffolds, or miniature circuit boards, for the precise assembly of components such as carbon nanotubes, nanowires and nanoparticles at dimensions significantly smaller than possible with conventional semiconductor fabrication techniques, said the researchers.
They say this opens up the possibility of creating functional devices that can be integrated into larger structures.
“The cost involved in shrinking features to improve performance is a limiting factor in keeping pace with Moore’s Law and a concern across the semiconductor industry,” said Spike Narayan, manager, Science & Technology, IBM Research - Almaden, in a statement. “The combination of this directed self-assembly with today’s fabrication technology eventually could lead to substantial savings in the most expensive and challenging part of the chip-making process.”
The paper, “Placement and orientation of DNA nanostructures on lithographically patterned surfaces,” by scientists at IBM Research and the California Institute of Technology, will be published in the September issue of Nature Nanotechnology.
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. 
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters.
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