Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
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Heilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
TTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
Future Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
Mouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
Wolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part... »
Synopsys and imec have announced a partnership to accelerate the development of 3-D stacked IC technologies. The partnership will leverage Synopsys' TCAD tools for characterizing and optimizing the reliability and electrical performance of through-silicon vias (TSVs) and imec's research facilities. »
IBM has eliminated perfluorooctane sulfonate (PFOS) and perfluorooctanoic acid (PFOA) compounds from its chip making processes as part of its design for the environment program. »
HP Enterprise Services has been selected by General Motors to implement an Apriso solution for better control over its battery manufacturing and supply chain operations at its new Chevrolet Volt battery assembly plant. »
The European Chemicals Agency (ECHA) is accepting comments on eight chemicals proposed as substances of very high concern (SVHC) by three EU member states under the EU's REACH regulation. Deadline is April 22. »
As large LCD panel suppliers continue to struggle to maintain profitability, many are forced to cut materials and components costs despite high growth in this market over the past few years, reports iSuppli. Adding to the challenge is a global shortage of LEDs, primarily... »
PCs and memory ICs will be the primary drivers for semiconductor revenue growth in 2010 with the market on track to reach $304 billion in 2012, according to Gartner Inc. The market researcher says rising DRAM prices, coupled with strong PC demand, will drive... »
Boosting its security and identify management solutions portfolio, AuthenTec has acquired SafeNet, Inc.'s Embedded Security Solutions Division in a cash and stock transaction. AuthenTec will also become the exclusive worldwide supplier of SafeNet's SafeXcel security processor ICs. »
During a global economic downturn, Fusion Trade, a global independent distributor of electronic components, has managed to keep its company on a significant growth path in 2009 marked with facility expansions, a new anti-counterfeit inspection lab, enhanced customers systems and industry certifications. »
ALLVIA, a through-silicon via (TSV) foundry, has integrated embedded capacitors onto silicon interposers, a key interface between a silicon device and an organic or ceramic substrate needed for managing high-interconnect densities. »
IPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
Welcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick.
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters.
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