Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
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Heilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
TTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
Future Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
Mouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
Wolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part... »
Hewlett-Packard is projected to be the top OEM semiconductor spender in 2010, spending an estimated $12.6 billion this year, compared to $10.99 billion in 2009, according to iSuppli Corp. Total semiconductor spending in 2010 among OEMs and EMS providers will record double-digit increases, according... »
The Soitec Group has inked a deal to supply SOI substrates to CSMC Technologies, a pure-play specialty analog foundry based in China. Soitec is sampling SOI substrates for high voltage (HV) and CMOS applications initially targeted at color plasma display panel (PDP) driver ICs... »
Avnet Electronics Marketing, Portescap, and Texas Instruments Inc. (TI) have launched a new 10-part, videocast series covering design ideas using motor control products and solutions. »
Smartphone shipments to Asia are expected to more than quadruple by 2015, accounting for 39 percent of total smartphone shipments in 2015, reports IMS Research. »
Aimed at advanced product applications that call for small form factors and low-power consumption, Novellus Systems and IBM Corp. are working on a joint development program to design a copper-based 3-D semiconductor through-silicon via (TSV) process leveraging Novellus' SABRE copper electroplating and VECTOR PECVD... »
IPC -- Association Connecting Electronics Industries is urging members of the EU Council and Parliament to ensure that the revised RoHS Directive be scientifically based and fully aligned with the REACH Regulation, according to the organization's new white paper. »
The global market for hard disk drives (HDDs) and optical disk drives (ODDs) used in computers is expected to climb as the PC market continues to strengthen, reports iSuppli Corp. The market researcher expects global revenue of HDD shipments to reach $27.7 million in... »
Avnet EMA unveils its Microcontroller Technology Spotlight series of multimedia instructional videos at its Online Technical Training Web site, delivering technology overviews and demonstrations on some of the most innovative microcontroller technology solutions in the market today. »
Applied Materials, a supplier of equipment to the semiconductor, flat panel display (FPD) and solar photovoltaic (PV) industries, recently opened its newly expanded Tainan Manufacturing Center in Tainan, Taiwan. »
IPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
Welcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies.
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency.
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